豆奶导航,色欲综合视频天天天,aaa国产大片 http://www.diywinechina.com 二極體的權威生產廠商 Fri, 23 Aug 2024 02:39:38 +0000 zh-Hans hourly 1 https://wordpress.org/?v=6.4.5 MCL1SS355 Micro MELF http://www.diywinechina.com/wpcproduct/mcl1ss355-micro-melf/ Wed, 21 Aug 2024 06:37:02 +0000 http://www.diywinechina.com/?post_type=wpcproduct&p=19419

SWITCHING DIODES

FEATURES

? High speed switching .
? Electrically ldentical to Standerd JEDEC
? High Conductanc
? Axial lead Package ldeally Suited for Automatic lnsertion

MECHANICAL DATA

? Case:MICROMELF,Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only

]]>

SWITCHING DIODES

FEATURES

? High speed switching .
? Electrically ldentical to Standerd JEDEC
? High Conductanc
? Axial lead Package ldeally Suited for Automatic lnsertion

MECHANICAL DATA

? Case:MICROMELF,Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only

]]> BZM55-B2V4~BZM55-B75 （Micro MELF） http://www.diywinechina.com/wpcproduct/bzm55-b2v4bzm55-b75-%ef%bc%88micro-melf%ef%bc%89/ Wed, 23 Mar 2022 08:55:52 +0000 http://www.diywinechina.com/?post_type=wpcproduct&p=18974

SURFACE MOUNT ZENER DIODES

FEATURES

  • Planar Die construction
  • 500mW Power Dissipation
  • Ideally Suited for Automated Assembly Processes
  • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EUdirective)MECHANICAL DATA
  • Case: Molded Glass MICRO-MELF
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Approx. Weight: 0.011 grams
  • Packing informationT/R - 3K per 7" plastic Reel T/R - 10K per 13" plastic Reel

BZM55-B2V4

BZM55-B2V7

BZM55-B3V0

BZM55-B3V3

BZM55-B3V6

BZM55-B3V9

BZM55-B4V3

BZM55-B4V7

BZM55-B5V1

BZM55-B5V6

BZM55-B6V2

BZM55-B6V8

BZM55-B7V5

BZM55-B8V2

BZM55-B9V1

BZM55-B10

BZM55-B11

BZM55-B12

BZM55-B13

BZM55-B15

BZM55-B16

BZM55-B18

BZM55-B20

BZM55-B22

BZM55-B24

BZM55-B27

BZM55-B30

BZM55-B33

BZM55-B36

BZM55-B39

BZM55-B43

BZM55-B47

BZM55-B51

BZM55-B56

BZM55-B62

BZM55-B68

BZM55-B75

]]>

SURFACE MOUNT ZENER DIODES

FEATURES

  • Planar Die construction
  • 500mW Power Dissipation
  • Ideally Suited for Automated Assembly Processes
  • Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EUdirective)MECHANICAL DATA
  • Case: Molded Glass MICRO-MELF
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Approx. Weight: 0.011 grams
  • Packing informationT/R - 3K per 7" plastic Reel T/R - 10K per 13" plastic Reel

BZM55-B2V4

BZM55-B2V7

BZM55-B3V0

BZM55-B3V3

BZM55-B3V6

BZM55-B3V9

BZM55-B4V3

BZM55-B4V7

BZM55-B5V1

BZM55-B5V6

BZM55-B6V2

BZM55-B6V8

BZM55-B7V5

BZM55-B8V2

BZM55-B9V1

BZM55-B10

BZM55-B11

BZM55-B12

BZM55-B13

BZM55-B15

BZM55-B16

BZM55-B18

BZM55-B20

BZM55-B22

BZM55-B24

BZM55-B27

BZM55-B30

BZM55-B33

BZM55-B36

BZM55-B39

BZM55-B43

BZM55-B47

BZM55-B51

BZM55-B56

BZM55-B62

BZM55-B68

BZM55-B75

]]> GMZJ2.0~GMZJ56 Micro MELF http://www.diywinechina.com/wpcproduct/gmzj2-0gmzj56/ Thu, 19 May 2016 04:04:56 +0000 http://www.diywinechina.com/?post_type=wpcproduct&p=5631

SURFACE MOUNT ZENER DIODES FEATURES

  • Planar Die construction
  • 500mW Power Dissipation
  • Ideally Suited for Automated Assembly Processes
  • Lead free in comply with EU RoHS 2002/95/EC directives

    MECHANICAL DATA

  • Case: Molded Glass MICRO-MELF
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Mounting Position: Any
  • Polarity : Color band denotes cathode end
]]>

SURFACE MOUNT ZENER DIODES FEATURES

  • Planar Die construction
  • 500mW Power Dissipation
  • Ideally Suited for Automated Assembly Processes
  • Lead free in comply with EU RoHS 2002/95/EC directives

    MECHANICAL DATA

  • Case: Molded Glass MICRO-MELF
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Mounting Position: Any
  • Polarity : Color band denotes cathode end
]]> GMZ2.0~GMZ56 http://www.diywinechina.com/wpcproduct/gmz2-0gmz56/ Thu, 19 May 2016 04:00:35 +0000 http://www.diywinechina.com/?post_type=wpcproduct&p=5629

SURFACE MOUNT ZENER DIODES FEATURES

  • Planar Die construction
  • 500mW Power Dissipation
  • Ideally Suited for Automated Assembly Processes
  • Lead free in comply with EU RoHS 2002/95/EC directives

    MECHANICAL DATA

  • Case: Molded Glass MICRO-MELF
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Mounting Position: Any
  • Polarity : Color band denotes cathode end
]]>

SURFACE MOUNT ZENER DIODES FEATURES

  • Planar Die construction
  • 500mW Power Dissipation
  • Ideally Suited for Automated Assembly Processes
  • Lead free in comply with EU RoHS 2002/95/EC directives

    MECHANICAL DATA

  • Case: Molded Glass MICRO-MELF
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Mounting Position: Any
  • Polarity : Color band denotes cathode end
]]> BZM5221B SERIES http://www.diywinechina.com/wpcproduct/bzm5221b-series/ Thu, 19 May 2016 03:45:08 +0000 http://www.diywinechina.com/?post_type=wpcproduct&p=5622

SURFACE MOUNT ZENER DIODES

FEATURES

  • Planar Die construction
  • 500mW Power Dissipation
  • Ideally Suited for Automated Assembly Processes
  • Lead free in comply with EU RoHS 2011/65/EU directivesMECHANICAL DATA
  • Case: Molded Glass MICRO-MELF
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Polarity: See Diagram Below
  • Mounting Position: Any
]]>

SURFACE MOUNT ZENER DIODES

FEATURES

  • Planar Die construction
  • 500mW Power Dissipation
  • Ideally Suited for Automated Assembly Processes
  • Lead free in comply with EU RoHS 2011/65/EU directivesMECHANICAL DATA
  • Case: Molded Glass MICRO-MELF
  • Terminals: Solderable per MIL-STD-750, Method 2026
  • Polarity: See Diagram Below
  • Mounting Position: Any
]]> MCL4448 MIRCO MELF http://www.diywinechina.com/wpcproduct/mcl4448/ Tue, 17 May 2016 08:19:25 +0000 http://www.diywinechina.com/?post_type=wpcproduct&p=5559

FAST SWITCHING SURFACE MOUNT DIODES

POWER

FEATURES

? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? Lead free in comply with EU RoHS 2002/95/EC directives.

MECHANICAL DATA

? Case: MICRO, MELF
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Color band denotes cathode end
? Marking: Cathode Band Only

]]>

FAST SWITCHING SURFACE MOUNT DIODES

POWER

FEATURES

? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? Lead free in comply with EU RoHS 2002/95/EC directives.

MECHANICAL DATA

? Case: MICRO, MELF
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Color band denotes cathode end
? Marking: Cathode Band Only

]]> MCL4150 MICRO MELF http://www.diywinechina.com/wpcproduct/mcl4150/ Tue, 17 May 2016 08:16:12 +0000 http://www.diywinechina.com/?post_type=wpcproduct&p=5554

FAST SWITCHING SURFACE MOUNT DIODES

FEATURES

? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? In compliance with EU RoHS 2002/95/EC directives

MECHANICAL DATA

? Case: QUADRD Melf, Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only

]]>

FAST SWITCHING SURFACE MOUNT DIODES

FEATURES

? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? In compliance with EU RoHS 2002/95/EC directives

MECHANICAL DATA

? Case: QUADRD Melf, Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only

]]> MCL4148 MICRO MELF http://www.diywinechina.com/wpcproduct/mcl4148/ Tue, 17 May 2016 08:11:27 +0000 http://www.diywinechina.com/?post_type=wpcproduct&p=5549

FAST SWITCHING SURFACE MOUNT DIODES

FEATURES

? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? Lead free in compliance with EU RoHS 2011/65/EU directive

MECHANICAL DATA

? Case:MICROMELF,Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only

]]>

FAST SWITCHING SURFACE MOUNT DIODES

FEATURES

? Fast switching Speed.
? Surface Mount Package Ideally Suited For Automatic Insertion. ? Silicon Epitaxal Planar Construction.
? Lead free in compliance with EU RoHS 2011/65/EU directive

MECHANICAL DATA

? Case:MICROMELF,Glass
? Terminals: Solderable per MIL-STD-750, Method 2026 ? Polarity: Cathode Band
? Marking: Cathode Band Only

]]> MCL914 http://www.diywinechina.com/wpcproduct/mcl914/ Tue, 17 May 2016 08:06:01 +0000 http://www.diywinechina.com/?post_type=wpcproduct&p=5544

SWITCHING DIODES

MICRO-MELF

Unit : inch (mm)

.040(1.0) .048(1.2)DIA.

.043(1.1) .008(0.2) .008(0.2)

.079(2.0) .071(1.8)

VOLTAGE

100 Volts

POWER

500 mWatts

FEATURES

? Fast switching Speed.
? Electrically ldentical to Standerd JEDEC
? High Conductance
? Axial lead Package ldeally Suited for Automatic lnsertion. ? In compliance with EU RoHS 2002/95/EC directives

MECHANICAL DATA

Case: Molded Glass MICRO MELF

Terminals: Solderable per MIL-STD-750, Method 2026

Polarity: See Diagram Below

Mounting Position: Any

]]>

SWITCHING DIODES

MICRO-MELF

Unit : inch (mm)

.040(1.0) .048(1.2)DIA.

.043(1.1) .008(0.2) .008(0.2)

.079(2.0) .071(1.8)

VOLTAGE

100 Volts

POWER

500 mWatts

FEATURES

? Fast switching Speed.
? Electrically ldentical to Standerd JEDEC
? High Conductance
? Axial lead Package ldeally Suited for Automatic lnsertion. ? In compliance with EU RoHS 2002/95/EC directives

MECHANICAL DATA

Case: Molded Glass MICRO MELF

Terminals: Solderable per MIL-STD-750, Method 2026

Polarity: See Diagram Below

Mounting Position: Any

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