SURFACE MOUNT ZENER DIODES
FEATURES
Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in compliance with EU RoHS 2011/65/EU directive
MECHANICAL DATA
Case: Molded Glass MINI-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Polarity : Color band denotes cathode end
