SURFACE MOUNT ZENER DIODES
FEATURES
- Planar Die construction
- 500mW Power Dissipation
- Ideally Suited for Automated Assembly Processes
- Lead free in compliance with EU RoHS2.0 (2011/65/EU & 2015/865/EUdirective)MECHANICAL DATA
- Case: Molded Glass MICRO-MELF
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 0.011 grams
- Packing informationT/R - 3K per 7" plastic Reel T/R - 10K per 13" plastic Reel
BZM55-B2V4
BZM55-B2V7
BZM55-B3V0
BZM55-B3V3
BZM55-B3V6
BZM55-B3V9
BZM55-B4V3
BZM55-B4V7
BZM55-B5V1
BZM55-B5V6
BZM55-B6V2
BZM55-B6V8
BZM55-B7V5
BZM55-B8V2
BZM55-B9V1
BZM55-B10
BZM55-B11
BZM55-B12
BZM55-B13
BZM55-B15
BZM55-B16
BZM55-B18
BZM55-B20
BZM55-B22
BZM55-B24
BZM55-B27
BZM55-B30
BZM55-B33
BZM55-B36
BZM55-B39
BZM55-B43
BZM55-B47
BZM55-B51
BZM55-B56
BZM55-B62
BZM55-B68
BZM55-B75
